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Pango Titan3 PG3T500 China FPGA High-End Development Platform

Board model: DUPG3T500 V1.0

The DUPG3T500 is built on the Pango Titan3 series PG3T500-6IFFBG676 China FPGA, integrating 242,176 LUT6 logic cells, 529,760 equivalent logic cells, ~12,288 DSP resources, on-chip PCIe Gen4 x8 hard block and 16 high-speed MGT transceivers. It follows a SoM + carrier board architecture and delivers five key upgrades over generic platforms: on-board 2×SFP+ cages land high-speed links directly — no FMC+ card needed for 1G/10G fiber; dual Ethernet (GbE + 2.5G) utilizes both on-chip EMACs, one for management/upstream and one for data acquisition or time sync; DDR4 upgraded from 2GB to 4GB with ECC, targeting video/image processing, radar data buffering and long-running industrial scenarios; 16GB eMMC replaces the pluggable Micro SD as the boot device, offering shock and dust resistance for industrial deployment; and the fixed 200MHz oscillator is replaced by a programmable clock (Si5341-class, China-compatible) supporting 100/156.25/200MHz outputs and SFP recovered clock, covering JESD204, multi-board sync and PRBS eye-diagram testing. The BOM increase for all five upgrades totals approximately $30–50 per unit; the reference price of $923 is significantly lower than the typical ~$1,200+ landing cost of a generic board plus FMC+ SFP card. The SoM can be shipped standalone for customer prototype-to-product migration.

$923 Tax not included · batch and customization supported

Interface, cooling, structure and batch supply can be customized per project · we respond within 1 business day after submission.

Specifications

Data source: www.profpga.net official product page

The DUPG3T500 is built on the Pango Titan3 series PG3T500-6IFFBG676 China FPGA, integrating 242,176 LUT6 logic cells, 529,760 equivalent logic cells, ~12,288 DSP resources, on-chip PCIe Gen4 x8 hard block and 16 high-speed MGT transceivers. It follows a SoM + carrier board architecture and delivers five key upgrades over generic platforms: on-board 2×SFP+ cages land high-speed links directly — no FMC+ card needed for 1G/10G fiber; dual Ethernet (GbE + 2.5G) utilizes both on-chip EMACs, one for management/upstream and one for data acquisition or time sync; DDR4 upgraded from 2GB to 4GB with ECC, targeting video/image processing, radar data buffering and long-running industrial scenarios; 16GB eMMC replaces the pluggable Micro SD as the boot device, offering shock and dust resistance for industrial deployment; and the fixed 200MHz oscillator is replaced by a programmable clock (Si5341-class, China-compatible) supporting 100/156.25/200MHz outputs and SFP recovered clock, covering JESD204, multi-board sync and PRBS eye-diagram testing. The BOM increase for all five upgrades totals approximately $30–50 per unit; the reference price of $923 is significantly lower than the typical ~$1,200+ landing cost of a generic board plus FMC+ SFP card. The SoM can be shipped standalone for customer prototype-to-product migration.

Parameter Specification
Board Model DUPG3T500 V1.0
FPGA Chip Pango Titan3 PG3T500-6IFFBG676
Chip Grade Industrial; temperature range -40°C ~ 85°C
LUT6 Logic Cells 242,176
Equivalent Logic Cells (LC) 529,760
Flip-Flops 484,352
Distributed RAM 6.3 Mb
On-chip Block RAM DRM 616×36Kb + HRM 68×288Kb + APM 1804
Clock Resources GPLL ×4 / PPLL ×8 / FPLL ×7
High-speed Transceivers (MGT) 16 channels
PCI Express On-chip hard block PCIe Gen4 x8 (gold-finger version reserved)
Ethernet MAC 2× EMAC
User I/O HPIO 98 / HDIO 54
On-board Memory 4GB DDR4 + ECC: 2× 2GB data dies (64-bit) + ECC parity
Boot Storage 16GB eMMC on-board (Micro SD slot retained for expansion)
Configuration Storage 2× 32MB QSPI Flash (FPGA configuration + user data)
Clock Source Programmable clock (Si5341-class, China-compatible; 100/156.25/200MHz multi-output)
Fiber Interface 2× SFP+ cages on-board (MGT direct, 1/10G optical modules)
Ethernet Dual: 1× GbE RGMII + 1× 2.5G RGMII PHY
FMC+ Expansion 1× FMC+: 34 LA differential pairs + 2 clock pairs + remaining MGT
Debug Interface USB-to-UART · 10-pin JTAG · 40-pin 2.54mm expansion header
User Interaction 7× LED + 4× push buttons + 1× reset
Power +12V input; on-board multi-rail power tree (0.85V/1.2V/1.8V/3.3V)
PCB SoM 80×60mm · Carrier 190×106mm · 2× 240-pin board-to-board connectors
Cooling Active: aluminum heat sink + fan (standard); passive heat sink optional

Typical Application Scenarios

One platform, many roles

Interested in this product or need customization?

We respond within 1 business day after submission, supporting selection consulting, parameter customization and batch supply.

Contact · +86 18621324348